Rapid and Scalable Transfer of Large‐Area Graphene Wafers

Author:

Hu Zhaoning12,Li Fangfang34,Wu Haotian2,Liao Junhao345,Wang Quan6,Chen Ge2,Shi Zhuofeng1,Zhu Yaqi1,Bu Saiyu12,Zhao Yixuan3,Shang Mingpeng34,Lu Qi7,Jia Kaicheng2,Xie Qin4,Wang Guorui6,Zhang Xiaodong8,Zhu Yinbo6,Wu Hengan6,Peng Hailin234,Lin Li12ORCID,Liu Zhongfan23ORCID

Affiliation:

1. School of Materials Science and Engineering Peking University Beijing 100871 P. R. China

2. Beijing Graphene Institute Beijing 100095 P. R. China

3. Center for Nanochemistry Beijing Science and Engineering Center for Nanocarbons Beijing National Laboratory for Molecular Science College of Chemistry and Molecular Engineering Peking University Beijing 100871 P. R. China

4. Academy for Advanced Interdisciplinary Studies Peking University Beijing 100871 P. R. China

5. National Center for Nanoscience and Technology Chinese Academy of Sciences Beijing 100190 P. R. China

6. CAS Key Laboratory of Mechanical Behavior and Design of Materials Department of Modern Mechanics University of Science and Technology of China Hefei 230027 P. R. China

7. College of Science China University of Petroleum Beijing 102249 P. R. China

8. College of Chemistry and Chemical Engineering Qingdao University Qingdao 266000 P. R. China

Abstract

AbstractRecently, scalable production of large‐area graphene films on metal foils with promising qualities is successfully achieved by eliminating grain boundaries, wrinkles, and adlayers. The transfer of graphene from growth metal substrates onto functional substrates remains one inescapable obstacle on the road to the real commercial applications of chemical vaport deposition (CVD) graphene films. Current transfer methods still require time‐consuming chemical reactions, which hinders its mass production, and produces cracks and contamination that strongly impede performance reproducibility. Therefore, graphene transfer techniques with fine intactness and cleanness of transferred graphene, and improved production efficiency would be ideal for the mass production of graphene films on destination substrates. Herein, through the engineering of interfacial forces enabled by sophisticated design of transfer medium, the crack‐free and clean transfer of 4‐inch‐sized graphene wafers onto silicon wafers within only 15 min is realized. The reported transfer method is an important leap over the long‐lasting obstacle of the batch‐scale graphene transfer without degrading the quality of graphene, bringing the graphene products close to the real applications.

Funder

National Natural Science Foundation of China

National Basic Research Program of China

Publisher

Wiley

Subject

Mechanical Engineering,Mechanics of Materials,General Materials Science

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