Interfacial aspects of adhesion in polymer nanocomposite thin-film devices-Reference-Cited by-同舟云学术

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Interfacial aspects of adhesion in polymer nanocomposite thin-film devices

Published:2010-01-15 Issue:2 Volume:115 Page:1054-1061
ISSN:0021-8995
Container-title:Journal of Applied Polymer Science
language:en
Short-container-title:J. Appl. Polym. Sci.

Author:

Murugaraj P.,Mainwaring D. E.,Chen L. G.,Sawant P.,Al Kobaisi M.,Yek W. M.

Publisher

Wiley

Subject

Materials Chemistry,Polymers and Plastics,Surfaces, Coatings and Films,General Chemistry

Reference28 articles.

1. Influences of chain rigidity, in‐plane orientation, and thickness on residual stress of polymer films

2. Anisotropic properties of high‐temperature polyimide thin films: Dielectric and thermal‐expansion behaviors

3. Study on effect of carbon black on behavior of conductive polymer composites with positive temperature coefficient

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1. Electrodeposited Co-P alloy and composite coatings: A review of progress towards replacement of conventional hard chromium deposits;Surface and Coatings Technology;2021-09

2. Performance evaluation of polysulfone/graphene nanocomposites;International Journal of Materials Research;2017-01-31

3. Impact of particle nanotopology on water transport through hydrophobic soils;Journal of Colloid and Interface Science;2015-12

4. Dependence of interfacial adhesion of Co–P film on its microstructure;Surface and Coatings Technology;2012-07

5. Effect of TiO2 on thermal and adhesive characteristics of poly(imide siloxane)/TiO2 hybrid films;Journal of Applied Polymer Science;2011-10-25

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