Influences of chain rigidity, in‐plane orientation, and thickness on residual stress of polymer films
Author:
Publisher
AIP Publishing
Subject
General Physics and Astronomy
Link
http://aip.scitation.org/doi/pdf/10.1063/1.356422
Reference19 articles.
1. Residual stress behaviour of isomeric PMDA-ODA polyimides
2. Anisotropic properties of high‐temperature polyimide thin films: Dielectric and thermal‐expansion behaviors
3. Re-examination of the relationship between packing coefficient and thermal expansion coefficient for aromatic polyimides
4. Measurement of Strains at Si‐SiO2 Interface
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