Effect of Aggregation Structure on Thermal Expansion Behavior of Polyimide Films with Different Thickness-Reference-Cited by-同舟云学术

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Effect of Aggregation Structure on Thermal Expansion Behavior of Polyimide Films with Different Thickness

Published:2022-07-21 Issue:12 Volume:40 Page:1651-1661
ISSN:0256-7679
Container-title:Chinese Journal of Polymer Science
language:en
Short-container-title:Chin J Polym Sci

Author:

Wang Chang-Ou,Zhai Lei,Mo Song,Liu Yi,Gao Meng-Yan,Jia Yan,He Min-Hui,Fan Lin

Publisher

Springer Science and Business Media LLC

Subject

Polymers and Plastics,Organic Chemistry,General Chemical Engineering

Link

https://link.springer.com/content/pdf/10.1007/s10118-022-2785-2.pdf

Reference45 articles.

1. Zhuang, Y.; Seong, J. G.; Lee, Y. M. Polyimides containing aliphatic/alicyclic segments in the main chains. Prog. Polym. Sci. 2019, 92, 35–88.

2. Long, Y. B.; Chen, X. J.; Wu, H. Y.; Zhou, Z. X.; Babu, S. S.; Wu, M. M.; Zhao, J.; Aldred, M. P.; Liu, S. W.; Chen, X. D.; Chi, Z. G.; Xu, J. R.; Zhang, Y. Rigid polyimides with thermally activated delayed fluorescence for polymer light-emitting diodes with high external quantum efficiency up to 21%. Angew. Chem. Int. Ed. 2021, 60, 7220–7226.

3. Zhang, G. D.; Fan, L.; Bai, L.; He, M. H.; Zhai, L.; Mo, S. Mesoscopic simulation assistant design of immiscible polyimide/BN blend films with enhanced thermal conductivity. Chinese J. Polym. Sci. 2018, 36, 1394–1402.

4. Zheng, S. S.; Dong, H.; Wang, S. H.; Dong, J.; Guo, T.; Zhao, X.; Zhang, Q. H. Scalable reaction-spinning of rigid-rod Upilex-S (R) type polyimide fiber with an ultrahigh Tg. Chinese J. Polym. Sci. 2021, 39, 592–600.

5. Numata, S.; Fujisaki, K.; Kinjo, N. Re-examination of the relationship between packing coefficient and thermal expansion coefficient for aromatic polyimides. Polymer 1987, 28, 2282–2288.

Cited by 5 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Effect of Low-temperature Imidization on Properties and Aggregation Structures of Polyimide Films with Different Rigidity;Chinese Journal of Polymer Science;2024-05-17

2. Thermally Conductive Polyimide/Boron Nitride Composite Films with Improved Interfacial Compatibility Based on Modified Fillers by Polyimide Brushes;Chinese Journal of Polymer Science;2023-05-18

3. Achieving both low thermal expansion and low birefringence for polyimides by regulating chain structures;European Polymer Journal;2023-05

4. Enhancing Molecular Chain Entanglement and π-π Stacking Toward the Improvement of Shape Memory Performance of Polyimide;Chinese Journal of Polymer Science;2023-01-31

5. Low-power laser manufacturing of copper tracks on 3D printed geometry using liquid polyimide coating;Nanoscale Advances;2023

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