Dependence of interfacial adhesion of Co–P film on its microstructure-Reference-Cited by-同舟云学术

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Dependence of interfacial adhesion of Co–P film on its microstructure

Published:2012-07 Issue:23 Volume:206 Page:4822-4827
ISSN:0257-8972
Container-title:Surface and Coatings Technology
language:en
Short-container-title:Surface and Coatings Technology

Author:

Lu Nianduan,Cai Jian,Li Liangliang

Funder

National Science and Technology Major Projects

Tsinghua University Initiative Scientific Research Program

China Postdoctoral Science Foundation

Scientific Research Foundation for the Returned Overseas Chinese Scholars, State Education Ministry

Publisher

Elsevier BV

Subject

Materials Chemistry,Surfaces, Coatings and Films,Surfaces and Interfaces,Condensed Matter Physics,General Chemistry

Reference36 articles.

1. The coupling effect of interfacial adhesion and tensile residual stress on a thin membrane adhered to a flat punch

2. Interfacial adhesion of polymeric adhesive film on different surfaces in the fabrication of polymer photonic devices

3. Interfacial adhesion of spin-coated thin adhesive film on silicon substrate for the fabrication of polymer optical waveguide

4. Interfacial aspects of adhesion in polymer nanocomposite thin-film devices

5. Mechanics of adhesion in MEMS—a review

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2. Impact of the phosphorus concentration on the morphological and corrosion behaviour of Ni-P, Co-P and Co-Ni-P electrodeposits;Transactions of the IMF;2023-07-27

3. Strong inhibition of boron dopant on IMC growth between electroplating Co(B) deposits and lead-free solders at 250 °C;Journal of Materials Science: Materials in Electronics;2023-05

4. Effect of P content on diffusion resistance and interfacial mechanical properties of crystalline Co–P coatings in solder joints;Journal of Materials Science: Materials in Electronics;2023-01-31

5. Strategies for solder joints with high shear strength, slow interfacial consumption, ductile intermetallic compounds using hybrid crystalline-amorphous Co-P coatings;Materials & Design;2022-12

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