Development and characterization of defatted pumpkin seed meal and halloysite nanoclay composite films for food packaging

Author:

Kumar Yaghuvendra1,Santhosh Ravichandran1,Hoque Monjurul2,Nath Debarshi1,Thakur Rahul1,Madhubabu Dasarigandla1,Suryavanshi Vedsagar Rajesh1,Singhi Harshi1,Ahmed Jasim3,Sarkar Preetam1ORCID

Affiliation:

1. Department of Food Process Engineering National Institute of Technology Rourkela Rourkela India

2. Teagasc Ashtown Food Research Centre, Teagasc, Ashtown, Dublin 15, Ireland and School of Food and Nutritional Sciences University College Cork Cork Ireland

3. Environment and Life Sciences Research Center Kuwait Institute for Scientific Research Kuwait City Kuwait

Abstract

AbstractThe valorization of agricultural by‐products into sustainable packaging materials is one of the best strategies to utilize industrial waste efficiently. In this study, defatted pumpkin seed meal (DPSM) has been converted into films by impregnating selected concentrations of halloysite (HS) nanoclay (1%, 2% and 3% w/w). Various analytical techniques, including scanning electron microscopy (SEM), X‐ray diffraction (XRD), differential scanning calorimetry (DSC) and barrier property measurements, were employed to characterize the developed films. The appearance of the roughness on the surface of the films was evident from SEM micrographs upon the addition of HS. No change in the crystallinity of DPSM occurred when HS was incorporated; however, the Tg showed a variation with the loading concentration of the clay. Fourier transform infrared spectroscopy (FTIR) spectroscopy indicated that the decrease in hydrogen bonding was associated with increasing the HS concentrations. The addition of HS improved the tensile strength, stress relaxation percentage and Young's modulus, while the elongation at break was reduced at a similar condition. The biodegradability of the film was excellent within 20 days of the burying period. Overall, the developed films could be a potential candidate for sustainable food packaging.

Publisher

Wiley

Subject

Mechanical Engineering,General Materials Science,General Chemistry

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