1. and , ‘Temperature dependence of microelectronic device failures’, Final Report on Contract DAAL01-90-C-0023, RAMSEARCH Co., College Park, MD, December 1990.
2. and , ‘A failure prediction model for wire bonds’, Proc. 1989 Int. Symp. on Hyb. Micro., 607–613 (1989).
3. and , ‘Stress driven diffusive voiding of aluminum conductor lines: a model for time dependent failure’, Report SAND 88-09 46, NTIS DE 89-0010507, Sandia National Laboratories, 1988.
4. and , ‘A physical model for hot electron induced degradation in MOSFET's’, IEEE Semiconductor Interface Specialist Conf., Ft. Lauderdale, FL, December 1983.
5. Temperature dependence of hot-electron-induced degradation in MOSFET's