Thermal Management of Air-Cooled Electronic Systems: New Challenges for Research-Reference-Cited by-同舟云学术

Thermal Management of Air-Cooled Electronic Systems: New Challenges for Research

Published:1994 Issue: Volume: Page:3-24
ISSN:
Container-title:Thermal Management of Electronic Systems
language:
Short-container-title:

Author:

Lasance C. J. M.

Publisher

Springer Netherlands

Link

http://link.springer.com/content/pdf/10.1007/978-94-011-1082-2_1.pdf

Reference77 articles.

1. Afzal N., Hussain T., 1984, “Mixed Convection over a Horizontal Plate”, Trans. ASME JHT, vol. 106, pp. 240–241

2. Aihara J., 1991, “Air Cooling Techniques by Natural Convection”, chapter 1 in ‘Cooling Techniques for Computers’, Aung W., ed., Hemisphere Publ., USA

3. Akella R., Fox M., Smith S., 1989, “Center for Integrated Manufacturing Decision Systems-An Overview”, IEEE/CHMT ′89 IEMT Symp., pp. 169-173

4. Andrews J., 1988, “Package Thermal Resistance Model: Dependency on Equipment Design”, IEEE Trans. CHMT, vol. 11, pp. 528–537

5. Arvizu D., Moffat R., 1982, “The Use of Superposition in Calculating Cooling Requirements for Circuit Board Mounted Electronic Components”, 32th Proc. Electr. Comp. Conf., pp.133-144

Cited by 6 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Optimization;Particulate Composites;2016

2. An Investigation Into the Potential of Low-Reynolds Number Eddy Viscosity Turbulent Flow Models to Predict Electronic Component Operational Temperature;Journal of Electronic Packaging;2005-03-01

3. On the Thermal Interaction Between an Isothermal Cylinder and Its Isothermal Enclosure for Cylinder Rayleigh Numbers of Order 104;Journal of Heat Transfer;2001-03-08

4. Natural Convection Heat Transfer of Metal Cuboids Flush Mounted in A Horizontal Plate;Thermal Management of Electronic Systems II;1997

5. An Interactive Thermal Characterization of Component Placement;Thermal Management of Electronic Systems II;1997