1. Adiutori E., 1989, “The New Heat Transfer”, Ventuno Press, West Chester, Ohio, USA
2. Anderson A. , 1990, “Convective Heat Transfer from Arrays of Modules with Non-Uniform Heat Release”,Thesis Stanford University, Stanford, USA
3. Andrews J., Mahalingam M., Berg, H., ,1981, “Thermal Characteristics of 16- and 40-Pin Plastic DIP’s”,IEEE Trans. CHMT, vol.4, pp.455–461
4. Andrews J., 1988, “Package Thermal Resistance Model: Dependency on Equipment Design”, IEEE Trans.CHMT, vol.11, pp.528–537
5. Arvizu D., Moffat R., 1982, “The Use of Superposition in Calculating Cooling Requirements for Circuit Board Mounted Electronic Components”, 32th Proc. Electr. Comp. Conf., pp.133–144