DELPHI: The Development of Libraries of Physical Models of Electronic Components for an Integrated Design Environment-Reference-Cited by-同舟云学术

DELPHI: The Development of Libraries of Physical Models of Electronic Components for an Integrated Design Environment

Published:1995 Issue: Volume: Page:63-89
ISSN:1381-3951
Container-title:Current Issues in Electronic Modeling
language:
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Author:

Rosten Harvey I,Lasance Clemens J M

Publisher

Springer US

Link

http://link.springer.com/content/pdf/10.1007/978-1-4615-2335-2_5.pdf

Reference27 articles.

1. V. B. Dutta, “Junction-to-Case Thermal Resistance — Still a Myth?”, 1988 Proceedings, Fourth IEEE Semiconductor Thermal and Temperature Measurement Symposium (SEMI-THERM 4)February 10–12, pp. 8–11San Deigo, CA1988.

2. H. Hardisty and J. Abboud, “Thermal Analysis of a Dual-in-Line Package Using the Finite Element Method”, IEE Proceedings, Vol. 134, Part 1, No. 1, pp. 23–31, February 1987.

3. M. Wills, “Thermal Analysis of Air-Cooled PCBs, Part 1”, May, 1983 Electr. Prod.11.

4. J. A. Andrews, “Package Thermal Resistance Model: Dependency on Equipment Design”, IEEE Trans, on CHMT, Dec. 1988, pp 528–537, Vol. 11, No. 4.

5. M. Pecht and E. Hakim, “The Influence of Temperature on Integrated Circuit Failure Mechanism”, in Advances in Thermal Modeling of Electronic Components and Systemsed. Bar-Cohen and Krause, ASME Press, 1993, pp. 61–152, ch. 2.

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