Epoxy composites with ceramic core-shell fillers for thermal management in electrical devices-Reference-Cited by-同舟云学术

Epoxy composites with ceramic core-shell fillers for thermal management in electrical devices

Published:2017-03-10 Issue:12 Volume:28 Page:1676-1682
ISSN:1042-7147
Container-title:Polymers for Advanced Technologies
language:en
Short-container-title:Polym. Adv. Technol.

Author:

Rybak Andrzej¹^ORCID,Gaska Karolina²,Kapusta Czeslaw²,Toche François³,Salles Vincent³

Affiliation:

1. ABB Corporate Research Center; Starowislna 13A 31-038 Kraków Poland

2. Faculty of Physics and Applied Computer Science, Department of Solid State Physics; AGH University of Science and Technology; Mickiewicza 30 30-059 Kraków Poland

3. Laboratoire des Multimatériaux et Interfaces, UMR 5615 CNRS - Université Lyon 1; Université de Lyon; 43 bd du 11 Novembre 1918 69622 Villeurbanne Cedex France

Publisher

Wiley

Subject

Polymers and Plastics

Reference37 articles.

1. Thermal conductivity enhancement of electrically insulating syndiotactic poly(styrene) matrix for diphasic conductive polymer composites

2. The thermal conductivity of epoxy-resin / powder composite materials

3. Enhanced thermal conductivity of epoxy-matrix composites with hybrid fillers

4. Magnetic-aligned, magnetite-filled epoxy composites with enhanced thermal conductivity

5. Boron nitride filled epoxy with improved thermal conductivity and dielectric breakdown strength

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