Technology of Standard SMT Components Embedded Into PCB by Using Different Materials as Filling Masses
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Published:2023-04-11
Issue:7
Volume:52
Page:4509-4520
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ISSN:0361-5235
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Container-title:Journal of Electronic Materials
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language:en
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Short-container-title:J. Electron. Mater.
Author:
Stęplewski WojciechORCID, Rybak Andrzej, Dziedzic Andrzej, Bialas Marcin, Wojcik Mariusz, Ostaszewski Dariusz, Ramotowski Edward, Janeczek Kamil, Chołaj Aneta, Kościelski Marek, Sitek Anna, Liszewska Dorota
Abstract
AbstractThe technique of embedding components inside printed circuit boards (PCBs) is described, using different filling masses. To investigate the possibility of placing the components inside the printed circuit board, a residual circuit breaker with an overload protection (RCBO) system was adapted. Four types of fillings (two epoxy and two silicone) were used in the tests, which were carried out showing the full functionality of the systems embedded in the PCB, regardless of the applied sealing compound. A certain disadvantage was the shrinkage of the applied masses, which was visible in some cases in the occurrence of gaps in the flooding spaces. However, it should be emphasized that the tests were preliminary and that the adjustment of the filling shrinkage will be optimized in subsequent tests.
Publisher
Springer Science and Business Media LLC
Subject
Materials Chemistry,Electrical and Electronic Engineering,Condensed Matter Physics,Electronic, Optical and Magnetic Materials
Reference39 articles.
1. D. Manessis, S.-F. Yen, A. Ostmann, R. Aschenbrenner, and H. Reichl, in Proc. 57th Electronic Components and Technology Conf., (Sparks, USA, 2007), p. 278–285 2. A. Efimenko and B.A. Ryabov, Tekhnologiya i Konstruirovanie v Elektronnoi Apparature 1, 3 (2018). 3. T. Hofmann, Embedding active and passive componentsin organic PCBs for more reliability and miniaturization. PCB Mag. 6, 32 (2017). 4. M. Wojcik, D. Witek, T. Klej, and E. Ramotowski, Embedding components in voltage converter PCB for size reduction and heat management, Circuit World 42/1, 17 (2016) 5. M. Baszynski, E. Ramotowski, D. Ostaszewski, T. Klej, and M. Wojcik, Evaluation of new technologies and materials for printed circuit boards with improved heat dissipation properties, Circuit World 42/1, 32 (2016)
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