Recent advances in thermal-conductive insulating polymer composites with various fillers-Reference-Cited by-同舟云学术

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Recent advances in thermal-conductive insulating polymer composites with various fillers

Published:2024-03 Issue: Volume:178 Page:107998
ISSN:1359-835X
Container-title:Composites Part A: Applied Science and Manufacturing
language:en
Short-container-title:Composites Part A: Applied Science and Manufacturing

Author:

Chen Qingguo,Yang Kailun,Feng Yu^ORCID,Liang Liang,Chi Minghe,Zhang Zhonghua,Chen Xuesong

Funder

Natural Science Foundation of Heilongjiang Province

Key Research and Development Program of Hunan Province of China

National Natural Science Foundation of China

Publisher

Elsevier BV

Subject

Mechanics of Materials,Ceramics and Composites

Reference289 articles.

1. Emerging washable textronics for imminent e-waste mitigation: strategies, reliability, and perspectives;Liman;J Mater Chem A,2022

2. Advances in biodegradable electronic skin: Material progress and recent applications in sensing, robotics, and human–machine interfaces;Zarei;Adv Mater,2023

3. Prospects of heat transfer approaches to dissipate high heat fluxes: Opportunities and challenges;Sefiane;Appl Therm Eng,2022

4. Review of high thermal conductivity polymer dielectrics for electrical insulation;Xiao;High Volt,2016

5. Recent progress in aromatic polyimide dielectrics for organic electronic devices and circuits;Ji;Adv Mater,2019

Cited by 16 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Filler-size matching strategy for highly thermal-conductive insulating BN/PMIA composite paper;International Journal of Heat and Mass Transfer;2024-12

2. Structure, properties and applications of multi-functional thermally conductive polymer composites;Journal of Materials Science & Technology;2024-11

3. Strategy for a high thermal conductivity and low thermal resistance under compression of oriented carbon fiber with spherical alumina thermal interface material;Composites Part A: Applied Science and Manufacturing;2024-10

4. Interface engineering via non-thermal atmospheric plasma for highly tensile insulating epoxy-impregnated aramid composite paper;Composites Science and Technology;2024-10

5. Covalent bond-assisted continuous interface structure for high thermal conductive polyimide composite films;Composites Part A: Applied Science and Manufacturing;2024-10

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