Variation in dielectric properties of an epoxy-novolac molding compound during dynamic cure
Author:
Publisher
Wiley
Subject
Materials Chemistry,Polymers and Plastics,General Chemistry,Materials Chemistry,Polymers and Plastics,General Chemistry
Reference26 articles.
1. VLSI Technology, 2nd Ed., McGraw-Hill, New York (1988).
2. Epoxy Molding Compounds as Encapsulation Materials for Microelectronic Devices
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4. DSC and 13C-NMR studies of the imidazole-accelerated reaction between epoxides and phenols
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Cited by 4 articles. 订阅此论文施引文献 订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献
1. Studies on the cure kinetics and networks properties of neat and polydimethylsioxane modified tetrafunctional epoxy resins;Journal of Applied Polymer Science;2010
2. Dynamic cure kinetics of epoxy-novolac compounds as studied by differential scanning calorimetry;Journal of Applied Polymer Science;2009-11-15
3. Dielectric properties of epoxy/silica composites used for microlectronic packaging, and their dependence on post-curing;Journal of Materials Science: Materials in Electronics;2001
4. Chemical and physical analyses for reactive polymers;Chemorheology of Polymers
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