Dynamic cure kinetics of epoxy-novolac compounds as studied by differential scanning calorimetry-Reference-Cited by-同舟云学术

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Dynamic cure kinetics of epoxy-novolac compounds as studied by differential scanning calorimetry

Published:2009-11-15 Issue:4 Volume:114 Page:2373-2377
ISSN:0021-8995
Container-title:Journal of Applied Polymer Science
language:en
Short-container-title:J. Appl. Polym. Sci.

Author:

Yang Shin-Shiao,Hsieh Tar-Hwa,Bi Hsiaotao T,Ho Ko-Shan,Ho Tsung-Han,Chen Ho-Ruei,Ye Shi-Hao,Chang Yu-Chen

Publisher

Wiley

Subject

Materials Chemistry,Polymers and Plastics,Surfaces, Coatings and Films,General Chemistry

Reference17 articles.

1. Epoxy Molding Compounds as Encapsulation Materials for Microelectronic Devices

2. Infrared and liquid chromatographic characterization of epoxy cresol novolac-phenol formaldehyde novolac-tertiary amine resin systems

3. Concurrent enthalpy recovery and curing phenomena in epoxy encapsulating materials for semiconductor applications

Cited by 5 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Cure kinetics, thermal stability, and dielectric properties of epoxy/barium ferrite/polyaniline composites;Thermochimica Acta;2015-01

2. Cure kinetics of hot cured unsaturated polyester (UP)/nanoclay nanocomposite including dual initiators;Plastics, Rubber and Composites;2014-12-22

3. Curing of DGEBA epoxy using a phenol-terminated hyperbranched curing agent: Cure kinetics, gelation, and the TTT cure diagram;Thermochimica Acta;2012-12

4. Cure kinetics of a glass/epoxy prepreg by dynamic differential scanning calorimetry;Journal of Applied Polymer Science;2010-10-11

5. Studies on the cure kinetics and networks properties of neat and polydimethylsioxane modified tetrafunctional epoxy resins;Journal of Applied Polymer Science;2010

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