X-ray determination of encapsulation stresses on silicon wafers
Author:
Publisher
Wiley
Subject
Materials Chemistry,Polymers and Plastics,General Chemistry,Materials Chemistry,Polymers and Plastics,General Chemistry
Reference35 articles.
1. and Nitto Electrical Industrial Co., Internal Report (1979).
2. Mechanical stresses likely to be encountered in the manufacture and use of plastically encapsulated devices
3. Internal stress of epoxide resin modified with spiro ortho-ester type resin
4. and Proc. Int. Rel. Phys, Symp., IEEE, 74 (1981).
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