Subject
Electrical and Electronic Engineering,Surfaces, Coatings and Films,Safety, Risk, Reliability and Quality,Condensed Matter Physics,Atomic and Molecular Physics, and Optics,Electronic, Optical and Magnetic Materials
Reference2 articles.
1. Theory of Elasticity;Timoshenko,1951
2. Annual Reports;Dale,1972
Cited by
10 articles.
订阅此论文施引文献
订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献
1. An experimental investigation of shear strength and adhesion on the chip-substrate joint in LED packaging;International Journal of Adhesion and Adhesives;2022-12
2. Pyrolysis-Based Material Recovery from Molding Resin for Electronic Parts;Journal of Environmental Engineering;1998-09
3. A method to predict cracking in IC plastic packages;IEEE Transactions on Components, Packaging, and Manufacturing Technology: Part B;1994-05
4. Thermal and Moisture Stresses in Plastic Packages;Thermal Stress and Strain in Microelectronics Packaging;1993
5. Plastic Packaging;Microelectronics Packaging Handbook;1989