Plastic Packaging-Reference-Cited by-同舟云学术

Plastic Packaging

Published:1989 Issue: Volume: Page:523-672
ISSN:
Container-title:Microelectronics Packaging Handbook
language:
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Author:

Robock Paul V.,Nguyen Luu T.

Publisher

Springer US

Link

http://link.springer.com/content/pdf/10.1007/978-1-4613-1069-3_8.pdf

Reference303 articles.

1. L.J. Gallace. “Reliability of Plastic Package CMOS Devices”,Solid State Technology23(9): pp. 102–108, 1980.

2. W.M. Paulson and R.W. Kirk. “The Effects of Phosphorus-Doped Passivation Glass on the Corrosion of Aluminum”Proc. I.E.E.E. 12th Ann. Rel. Physpp. 172–179, 1974

3. S.E. Ormrod and B.P. Richards. “Measurement and Interpretation of Phosphorus Concentration in Phosphosilicate Glass Passivation Layers”Microelectronics8(3): pp. 5–8, 1977.

4. J. Yim. “The Development of Laser Spectroscopy as a Method of Determining Moisture Levels in Semiconductor Packages”Proc. I.E.P.Spp. 727–735, 1986

5. D. Kane and M. Brizoux. “Recent Developments on Moisture Measurement by Surface Conductivity Sensors”Proc. 24th Rel. Physpp. 69–78, 1986

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