Reworkable Epoxies: Thermosets with Thermally Cleavable Groups for Controlled Network Breakdown
Author:
Affiliation:
1. Department of Materials Science and Engineering, Bard Hall, Cornell University, Ithaca, New York 14853-1501
2. IBM Microelectronics, Endicott, New York 13760
Publisher
American Chemical Society (ACS)
Subject
Materials Chemistry,General Chemical Engineering,General Chemistry
Link
https://pubs.acs.org/doi/pdf/10.1021/cm970667t
Reference22 articles.
1. Robock, P. V.; Nguyen, L. T. InMicroelectronics Packaging Handbook, Tummala, R. R., Rymaszewski, E. J., Eds.; Van Nostrand Reinhold: New York, 1989; p 523.
2. Reversible crosslinking in epoxy resins. II. New approaches
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