Determination of thermal stress distribution in a model microelectronic device encapsulated with alumina filled epoxy resin using fluorescence spectroscopy-Reference-Cited by-同舟云学术

Determination of thermal stress distribution in a model microelectronic device encapsulated with alumina filled epoxy resin using fluorescence spectroscopy

Published:2002-02 Issue:4 Volume:43 Page:1277-1285
ISSN:0032-3861
Container-title:Polymer
language:en
Short-container-title:Polymer

Author:

Muraki Naoki,Matoba Nobuhiro,Hirano Takayuki,Yoshikawa Masanobu

Publisher

Elsevier BV

Subject

Polymers and Plastics,Materials Chemistry,Organic Chemistry

Reference30 articles.

1. Epoxy Molding Compounds as Encapsulation Materials for Microelectronic Devices

2. Toughening of epoxy resins by modification with reactive elastomers composed of butyl acrylate and glycidyl (meth)acrylate

3. Effects of particle size on mechanical and impact properties of epoxy resin filled with spherical silica

4. Suzuki H, Tabata H, Imamura N, Oizumi S. Proceedings of ASC Division of Polymeric Materials Science and Engineering, Fall Meeting, Anaheim, CA, vol. 55. 1956. p. 811–5.

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