Unveiling 3D Morphology of Multiscale Micro‐Nanosilver Sintering for Advanced Electronics Manufacturing by Ptychographic X‐ray Nanotomography-Reference-Cited by-同舟云学术

Unveiling 3D Morphology of Multiscale Micro‐Nanosilver Sintering for Advanced Electronics Manufacturing by Ptychographic X‐ray Nanotomography

Published:2020-02-19 Issue:4 Volume:22 Page:1901250
ISSN:1438-1656
Container-title:Advanced Engineering Materials
language:en
Short-container-title:Adv. Eng. Mater.

Author:

Lin Yu-Chung¹,Liu Xiaoyang¹^ORCID,Chou Kang Wei²,Tsai Esther H. R.³⁴,Zhao Chonghang¹,Holler Mirko³,Diaz Ana³,Petrash Stanislas⁵,Chen-Wiegart Yu-chen Karen¹⁶

Affiliation:

1. Department of Materials Science and Chemical Engineering Stony Brook University Stony Brook NY 11794 USA

2. Henkel Adhesive Technologies Global Innovation Research Advanced Characterization Group Hendel Ibérica S.A. Campus UAB Edificio Eureka 08193 Bellaterra

3. Swiss Light Source Paul Scherrer Institute Forschungsstrasse 111 CH-5232 Villigen Switzerland

4. Center for Functional Nanomaterials Brookhaven National Laboratory Upton NY 11973 USA

5. Henkel Adhesive Technologies Global Innovation Research Advanced Characterization Group Henkel Corporation Bridgewater NJ 08807 USA

6. National Synchrotron Light Source II Brookhaven National Laboratory Upton NY 11973 USA

Funder

U.S. Department of Energy

Schweizerischer Nationalfonds zur Förderung der Wissenschaftlichen Forschung

Publisher

Wiley

Subject

Condensed Matter Physics,General Materials Science

Link

https://onlinelibrary.wiley.com/doi/pdf/10.1002/adem.201901250

Reference35 articles.

1. Solderable and electroplatable flexible electronic circuit on a porous stretchable elastomer

2. Electromigration and Thermomigration in Pb-Free Flip-Chip Solder Joints

3. Metal?metal bonding process using Ag metallo-organic nanoparticles

4. Low temperature sintering of Ag nanoparticles for flexible electronics packaging

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