Feasibility Investigation and Characterization of Liquid Dispersant–Assisted Sintering of Silver to Bond Large‐Area Plates-Reference-Cited by-同舟云学术

Feasibility Investigation and Characterization of Liquid Dispersant–Assisted Sintering of Silver to Bond Large‐Area Plates

Published:2023-01-18 Issue: Volume: Page:2201574
ISSN:1438-1656
Container-title:Advanced Engineering Materials
language:en
Short-container-title:Adv Eng Mater

Author:

Wei Wenyuan¹,Gao Lilan²^ORCID,Tan Yansong²^ORCID,Li Xin³,Wang Meiyu⁴,Mei Yunhui⁵,Lu Guoquan⁶

Affiliation:

1. Intelligent Connected-vehicles Technology Co. Ltd. China Automotive Technology and Research Center (CATARC) Tianjin 300300 P. R. China

2. Tianjin Key Laboratory for Advanced Mechatronic System Design and Intelligent Control School of Mechanical Engineering Tianjin University of Technology Tianjin 300384 P. R. China

3. School of Material Science and Engineering Tianjin University Tianjin 300350 P. R. China

4. College of Electronic Information and Optical Engineering Nankai University Tianjin 300350 P. R. China

5. School of Electrical Engineering Tiangong University Tianjin 300387 P. R. China

6. Department of Materials Science and Engineering Virginia Tech Blacksburg VA 24060 USA

Funder

National Natural Science Foundation of China

Natural Science Foundation of Tianjin City

Publisher

Wiley

Subject

Condensed Matter Physics,General Materials Science

Link

https://onlinelibrary.wiley.com/doi/pdf/10.1002/adem.202201574

Reference43 articles.

1. Reliability of Emerging Bonded Interface Materials for Large-Area Attachments

2. Thermal Interface Materials: Historical Perspective, Status, and Future Directions

3. Performance of Thermal Interface Materials

4. Research on sintering process and thermal conductivity of hybrid nanosilver solder paste based on molecular dynamics simulation

5. Pressureless sintering of nanosilver paste as die attachment on substrates with ENIG finish for semiconductor applications

Cited by 1 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Enhanced shear strength and microstructure of Cu–Cu interconnection by low-temperature sintering of Cu nanoparticles;Journal of Materials Science: Materials in Electronics;2024-04