Mechanical Behavior and Adhesion of the Ti/Cr/Au Metallization Scheme on Diamond Substrate-Reference-Cited by-同舟云学术

Mechanical Behavior and Adhesion of the Ti/Cr/Au Metallization Scheme on Diamond Substrate

Published:2017-06-14 Issue:8 Volume:19 Page:1700109
ISSN:1438-1656
Container-title:Advanced Engineering Materials
language:en
Short-container-title:Adv. Eng. Mater.

Author:

Msolli Sabeur¹,Alexis Joel²,Kim Heungsoo¹

Affiliation:

1. Prof. H. S. Kim, Prof. S. Msolli; Department of Mechanical; Robotics and Energy Engineering; Dongguk University-Seoul; 30 Pildong-ro 1-gil Jung-gu Seoul 04620 Republic of Korea

2. Prof. J. Alexis; Université de Toulouse; INP/ENIT; LGP; 47; Avenue d'Azereix; F-65013 Tarbes; France

Funder

French DGE project DIAMONIX

Publisher

Wiley

Subject

Condensed Matter Physics,General Materials Science

Link

http://onlinelibrary.wiley.com/wol1/doi/10.1002/adem.201700109/fullpdf

Reference24 articles.

1. Experimental characterization of the mechanical behavior of two solder alloys for high temperature power electronics applications

2. Au/(Ti—W) and Au/Cr metallization of chemically vapor-deposited diamond substrates for multichip module applications

3. High temperature contacts to chemically vapour deposited diamond films—reliability issues

4. Thermal stability of metallized CVD diamond

5. Metallization of CVD diamond films by ion beam assisted deposition

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