Thermal stability of metallized CVD diamond-Reference-Cited by-同舟云学术

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Thermal stability of metallized CVD diamond

Published:1996-09 Issue:1-2 Volume:286 Page:264-269
ISSN:0040-6090
Container-title:Thin Solid Films
language:en
Short-container-title:Thin Solid Films

Author:

Iacovangelo C.D

Publisher

Elsevier BV

Subject

Materials Chemistry,Metals and Alloys,Surfaces, Coatings and Films,Surfaces and Interfaces,Electronic, Optical and Magnetic Materials

Reference16 articles.

1. The world's first commercial application of a novel synthetic diamond material combined with an advanced metallization bonding technique;AT&T;Wall Street J.,1992

2. General Electric, Development of free standing diamond manufacturing technology for thermal management substrates, ARPA #N00014-91-C-2167.

3. Applicability of diamond substrates to multi-chip modules;Eden,1991

4. Diamond Optics V;Xiang-Liu;SPIE,1992

Cited by 7 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Adhesion of electrodes on diamond (111) surface: A DFT study;Diamond and Related Materials;2018-01

2. Mechanical Behavior and Adhesion of the Ti/Cr/Au Metallization Scheme on Diamond Substrate;Advanced Engineering Materials;2017-06-14

3. The interface diffusion and reaction between Cr layer and diamond particle during metallization;Applied Surface Science;2001-02

4. The interdiffusion of Sn from AuSn solder with the barrier metal deposited on diamond;Materials Research Bulletin;2001-01

5. Metallization of CVD diamond films by ion beam assisted deposition;Materials Chemistry and Physics;2000-02

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