Pulse and pulse reverse plating of copper from acid sulphate solutions-Reference-Cited by-同舟云学术

Pulse and pulse reverse plating of copper from acid sulphate solutions

Published:2010-09 Issue:5 Volume:88 Page:243-247
ISSN:0020-2967
Container-title:Transactions of the IMF
language:en
Short-container-title:Transactions of the IMF

Author:

Leisner P.,Fredenberg M.,Belov I.

Publisher

Informa UK Limited

Subject

Metals and Alloys,Surfaces, Coatings and Films,Surfaces and Interfaces,Mechanics of Materials,Condensed Matter Physics

Link

http://www.tandfonline.com/doi/pdf/10.1179/002029610X12791981507721

Reference35 articles.

1. G. T. Bakhvalov: 'New technology in electrodeposition of metals — current reversal in electroplating', 46–51; 1966, Moscow, Metallurgia Publishing House.

2. Physical and Mechanical Properties of Electrodeposited Copper

3. Mathematical model and digital simulation of pulsating overpotential copper electrodeposition

4. Fundamental aspects of pulsating current metal electrodeposition I: The effect of the pulsating current on the surface roughness and the porosity of metal deposits

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