Tutorial on forming through-silicon vias-Reference-Cited by-同舟云学术

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Tutorial on forming through-silicon vias

Published:2020-05 Issue:3 Volume:38 Page:031202
ISSN:0734-2101
Container-title:Journal of Vacuum Science & Technology A
language:en
Short-container-title:Journal of Vacuum Science & Technology A

Author:

Burkett Susan L.¹,Jordan Matthew B.²,Schmitt Rebecca P.²³,Menk Lyle A.²³,Hollowell Andrew E.²

Affiliation:

1. Department of Electrical and Computer Engineering, The University of Alabama, P. O. Box 872086, Tuscaloosa, Alabama 35487

2. Sandia National Laboratories, Albuquerque, New Mexico 87185

3. Department of Chemical Engineering, The University of New Mexico, Albuquerque, New Mexico 87131

Funder

The National Science Foundation

Air Force Research Laboratory

Publisher

American Vacuum Society

Subject

Surfaces, Coatings and Films,Surfaces and Interfaces,Condensed Matter Physics

Link

http://avs.scitation.org/doi/am-pdf/10.1116/6.0000026

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