Investigation of fracture behaviors in copper influenced by the angle of oblique edge nanocrack
Author:
Funder
Inha University
Publisher
Springer Science and Business Media LLC
Link
https://link.springer.com/content/pdf/10.1007/s10853-024-10060-5.pdf
Reference67 articles.
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2. Xiao ZE, Chen J, Liu J, Liang T, Xu Y, Zhu C, Zhong S (2019) Microcrystalline copper foil as a high performance collector for lithium-ion batteries. J Power Sources 438:226973–226982. https://doi.org/10.1016/j.jpowsour.2019.226973
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4. Roustaie F, Quednau S, Weissenborn F, Birlem O (2021) Low-resistance room-temperature interconnection technique for bonding fine pitch bumps. J Mater Eng Perform 30:3173–3177. https://doi.org/10.1007/s11665-021-05649-9
5. Tseng YC, Kiat Goh SC, Darshini S, Venkataraman N, Sundaram A, Khang TC, Ok YJ, Chui KJ (2023) A precise wafer thinning integration process for nano-TSV formation. In: 2023 IEEE 73rd electronic components and technology conference (ECTC), pp 1170–1174. https://doi.org/10.1109/ECTC51909.2023.00200
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