Interfacial reaction of Bi–Ag and Bi–Sb solders on copper substrate with multiple reflow number-Reference-Cited by-同舟云学术

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Interfacial reaction of Bi–Ag and Bi–Sb solders on copper substrate with multiple reflow number

Published:2014-12-05 Issue:sup6 Volume:18 Page:S6-318-S6-321
ISSN:1432-8917
Container-title:Materials Research Innovations
language:en
Short-container-title:Materials Research Innovations

Author:

Nahavandi M.¹,Hanim M. A. A.¹²,Ismarrubie Z. N.¹,Baserfalak F.¹

Affiliation:

1. Department of Mechanical and Manufacturing EngineeringFaculty of Engineering, Universiti Putra Malaysia, 43400 Serdang, Selangor, Malaysia

2. Institute of Tropical Forestry and Forest ProductsUniversiti Putra Malaysia, 43400 Serdang, Selangor, Malaysia

Publisher

Informa UK Limited

Subject

Mechanical Engineering,Mechanics of Materials,Condensed Matter Physics,General Materials Science

Link

https://www.tandfonline.com/doi/pdf/10.1179/1432891714Z.000000000976

Reference28 articles.

1. Printed circuit board industry

2. Development of high-temperature solders: Review

3. J. W. Evans, W. Engelmaier, D. Kwon and J. Y. Evans: ‘A guide to lead-free solders: physical metallurgy and reliability’ 2007, Germany, Springer.

Cited by 4 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Microstructure Growth Morphologies, Macrosegregation, and Microhardness in Bi–Sb Thermal Interface Alloys;Advanced Engineering Materials;2020-03-13

2. Bi-Based Interconnect Systems and Applications;Harsh Environment Electronics;2019-03-29

3. Design of diffusion barrier and buffer layers for β-Zn4Sb3 mid-temperature thermoelectric modules;Journal of Alloys and Compounds;2018-09

4. Effects of Sn addition on the microstructure and properties of Bi–11Ag high-temperature solder;Journal of Materials Science: Materials in Electronics;2018-05-21

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