Design of diffusion barrier and buffer layers for β-Zn4Sb3 mid-temperature thermoelectric modules

Author:

Chen Li-Wei,Wang Cheng,Liao Yi-Chia,Li Chia-Lin,Chuang Tung-Han,Hsueh Chun-HwayORCID

Funder

Ministry of Science and Technology, Taiwan

Publisher

Elsevier BV

Subject

Materials Chemistry,Metals and Alloys,Mechanical Engineering,Mechanics of Materials

Reference54 articles.

1. Barrier/bonding layers on bismuth telluride (Bi2Te3) for high temperature thermoelectric modules;Lin;J. Mater. Sci. Mater. Electron.,2011

2. Microstructure and aging resistance of the joints between SAC305 solder and thermoelectric materials with different diffusion barriers;Cheng;Kovove Mater.,2014

3. Recent developments in β-Zn4Sb3 based thermoelectric compounds;Zou;J. Nanomater.,2015

4. Transport properties of β-Zn4Sb3 prepared by vacuum melting;Zhu;Mater. Lett.,2000

5. Thermoelectric properties of semi-conducting compound Zn4Sb3;Chitroub;J. Alloys Compd.,2008

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