Interfacial reaction and mechanical reliability of eutectic Sn–0·7Cu/immersion Ag-plated Cu solder joint
Author:
Publisher
Informa UK Limited
Subject
Mechanical Engineering,Mechanics of Materials,Condensed Matter Physics,General Materials Science
Link
http://www.tandfonline.com/doi/pdf/10.1179/174328408X374739
Reference19 articles.
1. Six cases of reliability study of Pb-free solder joints in electronic packaging technology
2. Study of immersion silver and tin printed-circuit-board surface finishes in lead-free solder applications
3. Lead-free Solders in Microelectronics
4. IMC Growth and Shear Strength of Sn-Ag-Bi-In/Au/Ni/Cu BGA Joints During Aging
5. Interfacial Microstructure Evolution Between Eutectic SnAgCu Solder and Al/Ni(V)/Cu Thin Films
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1. Study on Cu6Sn5 morphology and grain orientation transition at the interface of (111) nt-Cu and liquid Sn;Journal of Materials Research and Technology;2023-09
2. Microstructural and shear strength properties of GNSs-reinforced Sn-1.0Ag-0.5Cu (SAC105) composite solder interconnects on plain Cu and ENIAg surface finish;Journal of Materials Research and Technology;2021-11
3. Effect of Hygrothermal Treatment on Reliability of Thermo-Compression Bonded FPCB/RPCB Contact Joints;MATERIALS TRANSACTIONS;2016
4. Effect of rare earth metal Ce addition to Sn-Ag solder on interfacial reactions with Cu substrate;Metals and Materials International;2014-05
5. The effect of reflow time on reactive wetting, evolution of interfacial IMCs and shear strength of eutectic Sn–Cu solder alloy;Journal of Materials Science: Materials in Electronics;2014-01-29
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