Effect of Zn addition on steady state creep characteristics of Sn–3·3Ag solder alloy
Author:
Publisher
Informa UK Limited
Subject
Mechanical Engineering,Mechanics of Materials,Condensed Matter Physics,General Materials Science
Link
http://www.tandfonline.com/doi/pdf/10.1179/174328408X278457
Reference23 articles.
1. Modelling the creep rates of eutectic Bi–Sn solder using the data from its constitutive phases
2. Creep behavior of eutectic Sn-Cu lead-free solder alloy
3. Effects of Cu, Ag and Sb on the creep-rupture strength of lead-free solder alloys
4. Evaluation of creep behavior of near-eutectic Sn–Ag solders containing small amount of alloy additions
5. Effect of bismuth on the isothermal fatigue properties of Sn-3.5mass%Ag solder alloy
Cited by 5 articles. 订阅此论文施引文献 订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献
1. Effect of Zn and Sb Additions on the Impression Creep Behavior of Lead-Free Sn-3.5Ag Solder Alloy;Journal of Electronic Materials;2015-11-17
2. Effects of torsional oscillation on tensile behavior of Sn–3.5 wt% Ag alloy with and without adding ZnO nanoparticles;Materials Science and Engineering: A;2014-07
3. Effect of aging treatment on microstructure and creep behaviour of Sn–Ag and Sn–Ag–Bi solder alloys;Materials Science and Technology;2013-12-06
4. Indentation creep of lead-free Sn–3.5Ag solder alloy: Effects of cooling rate and Zn/Sb addition;Materials Science and Engineering: A;2013-03
5. Effect of Ag addition on the creep characteristics of Sn–8.8wt%Zn solder alloy;Journal of Alloys and Compounds;2009-06
1.学者识别学者识别
2.学术分析学术分析
3.人才评估人才评估
"同舟云学术"是以全球学者为主线，采集、加工和组织学术论文而形成的新型学术文献查询和分析系统，可以对全球学者进行文献检索和人才价值评估。用户可以通过关注某些学科领域的顶尖人物而持续追踪该领域的学科进展和研究前沿。经过近期的数据扩容，当前同舟云学术共收录了国内外主流学术期刊6万余种，收集的期刊论文及会议论文总量共计约1.5亿篇，并以每天添加12000余篇中外论文的速度递增。我们也可以为用户提供个性化、定制化的学者数据。欢迎来电咨询！咨询电话：010-8811{复制后删除}0370
www.globalauthorid.com
TOP
Copyright © 2019-2024 北京同舟云网络信息技术有限公司 京公网安备11010802033243号 京ICP备18003416号-3