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Indentation creep of lead-free Sn–3.5Ag solder alloy: Effects of cooling rate and Zn/Sb addition

  • Published:2013-03 Issue: Volume:565 Page:236-242
  • ISSN:0921-5093
  • Container-title:Materials Science and Engineering: A
  • language:en
  • Short-container-title:Materials Science and Engineering: A

Author:

Mahmudi R.,Pourmajidian M.,Geranmayeh A.R.,Gorgannejad S.,Hashemizadeh S.

Publisher

Elsevier BV

Subject

Mechanical Engineering,Mechanics of Materials,Condensed Matter Physics,General Materials Science

Cited by 18 articles. 订阅此论文施引文献 订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Effect of Ag interlayer on the microstructural properties and nanocreep behavior of Ti6Al4V/AA7075 dissimilar laser weldments;Proceedings of the Institution of Mechanical Engineers, Part L: Journal of Materials: Design and Applications;2024-03-28

2. Hypo-eutectic microstructure formation and nanomechanical response in Sn-3.0Ag-0.5Cu solder balls: Effects of undercooling;Materials Characterization;2023-04

3. Effect of pulsed Nd: YAG laser welding power on the microstructures and nano creep behavior of Inconel 718 weld beads;Reference Module in Materials Science and Materials Engineering;2023

4. Selective etching of lead-free solder alloys: A brief review;Materials Today Communications;2022-12

5. Influence of pulsed Nd:YAG laser welding power on the microstructures and nano creep behaviour of Ti5Al2.5Sn beads;Proceedings of the Institution of Mechanical Engineers, Part L: Journal of Materials: Design and Applications;2022-11-27
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