Method to design stoichiometric deposition reactive sputtering without hysteresis
Author:
Publisher
Informa UK Limited
Subject
Materials Chemistry,Surfaces, Coatings and Films,Surfaces and Interfaces,Condensed Matter Physics
Link
http://www.tandfonline.com/doi/pdf/10.1179/1743294413Y.0000000155
Reference27 articles.
1. Influence of processing parameters on deposition rate and crystal structure of reactively sputtered HfC
2. Morphological investigation of aluminium nitride films on various substrates for MEMS applications
3. Influence of nitrogen flow rate on growth of TiAlN films prepared by DC magnetron sputtering
4. Deposition of nickel oxide by direct current reactive sputtering
5. Microcrystalline germanium thin films prepared by reactive RF sputtering
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1. Modeling of Reactive Sputtering—History and Development;Materials;2023-04-20
2. Including substrate temperature in Berg model for reactive sputtering;Thin Solid Films;2020-02
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