Factors influencing current density distribution and current crowding in flip chip solder joints
Author:
Publisher
Informa UK Limited
Subject
Condensed Matter Physics,General Materials Science
Link
https://www.tandfonline.com/doi/pdf/10.1179/174329307X213774
Reference29 articles.
1. Electromigration of eutectic SnPb solder interconnects for flip chip technology
2. Thermomigration in Pb–Sn solder joints under joule heating during electric current stressing
3. Damage mechanics of microelectronics solder joints under high current densities
4. Effect of electromigration on interfacial reactions between electroless Ni-P and Sn–3.5% Ag solder
5. Electromigration failure mechanisms for SnAg3.5 solder bumps on Ti∕Cr-Cu∕Cu and Ni(P)∕Au metallization pads
Cited by 3 articles. 订阅此论文施引文献 订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献
1. Effect of Bump Shape on Current Density and Temperature Distributions in Solder Bump Joints under Electromigration;Advanced Materials Research;2012-09
2. Thermal-Mechanical Stress Modeling of Copper Chip-to-Substrate Pillar Connections;IEEE Transactions on Components and Packaging Technologies;2010-09
3. Electromigration and Thermomigration in Pb-Free Flip-Chip Solder Joints;Annual Review of Materials Research;2010-06-01
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