Producing fine pitch substrate of COF by semiadditive process and pulse reverse plating of Cu-Reference-Cited by-同舟云学术

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Producing fine pitch substrate of COF by semiadditive process and pulse reverse plating of Cu

Published:2009-01 Issue:1 Volume:87 Page:33-37
ISSN:0020-2967
Container-title:Transactions of the IMF
language:en
Short-container-title:Transactions of the IMF

Author:

He W.,Cui H.,Mo Y. Q.,Wang S. X.,He B.,Hu K.,Guan J.,Liu S. L.,Wang Y.

Publisher

Informa UK Limited

Subject

Metals and Alloys,Surfaces, Coatings and Films,Surfaces and Interfaces,Mechanics of Materials,Condensed Matter Physics

Link

http://www.tandfonline.com/doi/pdf/10.1179/174591908X371186

Reference8 articles.

1. New high-density multilayer technology on PCB

2. Direct Electroless Copper Plating on Polyimide for FPCB Applications

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2. Study on fine lines and undercut suppression of printed circuit board prepared by electrolytic etching;Circuit World;2021-08-03

3. Fabrication and surface treatment of fine copper lines for HDI printed circuit board with modified full-additive method;Circuit World;2017-08-07

4. An electrochemical model for prediction of microvia filling process;Transactions of the IMF;2016-01-02

5. Study on process technique of PCBs with ladder conductive lines;Circuit World;2015-02-02

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