1. Copper etching with cupric chloride and regeneration of waste etchant;Journal of Materials Processing Technology,2006
2. Fabrication of conductive copper patterns using reactive inkjet printing followed by two-step electroless plating;Applied Surface Science,2017
3. Adhesion promotion technology for semi-additive process,2008
4. Comsol (2015), “Fick’s laws”, http://cn.comsol.com/multiphysics/diffusion-equation?parent=diffusion-0402-392-412 (accessed 14 January 2015).
5. Dickinson, E. (2018), “Modeling adsorption at surfaces in COMSOL Multiphysics®”, available at: https://www.comsol.com/blogs/modeling-adsorption-at-surfaces-in-comsol-multiphysics/ (accessed 26 January 2018).