An electrochemical model for prediction of microvia filling process-Reference-Cited by-同舟云学术

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An electrochemical model for prediction of microvia filling process

Published:2016-01-02 Issue:1 Volume:94 Page:49-56
ISSN:0020-2967
Container-title:Transactions of the IMF
language:en
Short-container-title:Transactions of the IMF

Author:

Ji L. X.,Wang C.,Wang S. X.,He W.,Xiao D. J.

Publisher

Informa UK Limited

Subject

Metals and Alloys,Surfaces, Coatings and Films,Surfaces and Interfaces,Mechanics of Materials,Condensed Matter Physics

Link

http://www.tandfonline.com/doi/pdf/10.1080/00202967.2015.1124638

Reference21 articles.

1. Plating Uniformity of Bottom-up Copper Pillars and Patterns for IC Substrates with Additive-assisted Electrodeposition

2. Sensitivity Enhancement for Quantitative Electrochemical Determination of a Trace Amount of Accelerator in Copper Plating Solutions

3. Superconformal Film Growth: Mechanism and Quantification

4. Producing fine pitch substrate of COF by semiadditive process and pulse reverse plating of Cu

5. Classification of suppressor additives based on synergistic and antagonistic ensemble effects

Cited by 10 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Numerical simulation of copper electrodeposition for Through Silicon Via (TSV) with SPS-PEG-Cl additive system;Microelectronics Journal;2024-02

2. Survey of P-Block Metal Additives for Superconformal Cu Deposition in an Alkaline Electrolyte;Journal of The Electrochemical Society;2022-09-01

3. Improving accuracy of filling performance prediction in microvia copper electroplating;Journal of Electroanalytical Chemistry;2020-08

4. Superconformal Deposition;Surface and Interface Science;2020-01-17

5. Design of Printed Circuit Board Production using Water Jet Technology;TEM Journal;2019-11-30

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