Introduction of Routable Molded Lead Frame and its Application

Author:

Kim ByongJin,Bang Wonbae,Kim GiJung,Jung JiYoung,Yoon JuHoon

Publisher

The Korean Microelectronics and Packaging Society

Cited by 5 articles. 订阅此论文施引文献 订阅此论文施引文献,注册后可以免费订阅5篇论文的施引文献,订阅后可以查看论文全部施引文献

1. High Performance Multi-Chip Leadframe Package with Internal Connection;2022 IEEE 24th Electronics Packaging Technology Conference (EPTC);2022-12-07

2. Wettable flank routable thin MicroLeadFrame for automotive applications;Microelectronics Reliability;2022-08

3. Interfacial Delamination at Multilayer Thin Films in Semiconductor Devices;ACS Omega;2022-07-14

4. EMI shielding leadless package solution for automotive;Journal of Advanced Joining Processes;2022-06

5. 3D Embedded Power Package Module to Integrate Various Power Systems;2022 IEEE 72nd Electronic Components and Technology Conference (ECTC);2022-05

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