EMI shielding leadless package solution for automotive-Reference-Cited by-同舟云学术

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EMI shielding leadless package solution for automotive

Published:2022-06 Issue: Volume:5 Page:100102
ISSN:2666-3309
Container-title:Journal of Advanced Joining Processes
language:en
Short-container-title:Journal of Advanced Joining Processes

Author:

Kim ByongJin,Jeon HyeongIl,Park DaeYoung,Kim GiJeong,Cho Nam-Hee,Khim JinYoung

Publisher

Elsevier BV

Subject

Mechanical Engineering,Mechanics of Materials,Engineering (miscellaneous),Chemical Engineering (miscellaneous)

Reference9 articles.

1. H. Chang, J.J. Chen, V. Chen, S. Leou and T. Wang, "Novel multiple compartments shielding for high performance RF design — LTE modem SiP," 2014 9th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT), 2014, pp. 200–203, doi: 10.1109/IMPACT.2014.7048417.

2. J.V. Hoang, R. Darveaux, T. Lobianco, Y. Liu and W. Nguyen, "Breakthrough packaging level shielding techniques and EMI effectiveness modeling and characterization," 2016 IEEE 66th Electronic Components and Technology Conference (ECTC), 2016, pp. 1290–1296, doi: 10.1109/ECTC.2016.300.

3. N. Karim, Jingkun Mao and Jun Fan, "Improving electromagnetic compatibility performance of packages and SiP modules using a conformal shielding solution," 2010 Asia-Pacific International Symposium on Electromagnetic Compatibility, 2010, pp. 56–59, doi: 10.1109/APEMC.2010.5475724.

4. Introduction of routable molded lead frame and its application;Kim;J. Microelectron. Packag. Soc.,2015

5. Leadframe SiP with conformal shield;Kim;J. Microelectron. Packag. Soc.,2016

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1. Large-area (50 cm × 50 cm) optically transparent electromagnetic interference (EMI) shielding of ZTO/Ag/ZTO: an analytical/numerical and experimental study of optoelectrical and EMI shielding properties;Journal of Physics D: Applied Physics;2024-05-24

2. NiZnFe2O4 core-shell nanoflowers as effective EMI shielding material dedicated to the absorption of electromagnetic waves in the UHF band and wide temperature range;Scripta Materialia;2024-04

3. Robust fast direct integral equation solver for three-dimensional doubly periodic scattering problems with a large number of layers;Journal of Computational Physics;2023-12

4. Fabrication of Ultra-thin Conformal EMI Shielding Coatings on SiP Modules by Inkjet Printing Technology;2023 24th International Conference on Electronic Packaging Technology (ICEPT);2023-08-08

5. Near-Field EMI Analysis of LPDDR5 DRAM at idle mode;2023 IEEE Symposium on Electromagnetic Compatibility & Signal/Power Integrity (EMC+SIPI);2023-07-29

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