Breakthrough Packaging Level Shielding Techniques and EMI Effectiveness Modeling and Characterization-Reference-Cited by-同舟云学术

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Breakthrough Packaging Level Shielding Techniques and EMI Effectiveness Modeling and Characterization

Published:2016-05 Issue: Volume: Page:
ISSN:
Container-title:2016 IEEE 66th Electronic Components and Technology Conference (ECTC)
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Author:

Hoang Jimmy-Dinh V.,Darveaux Robert,Lobianco Tony,Liu Yi,Nguyen Wayne

Publisher

IEEE

Link

http://xplorestaging.ieee.org/ielx7/7542794/7545393/07545591.pdf?arnumber=7545591

Cited by 21 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Prefabricated and Assembled Electromagnetic Shields Inside Electronic Packages to Reduce Near-Field Capacitive and Inductive Coupling;IEEE Transactions on Components, Packaging and Manufacturing Technology;2024-06

2. Hardware-Based Methods for Electronic Device Protection against Invasive and Non-Invasive Attacks;Electronics;2023-11-02

3. Correspondence of Frequency Dispersion of Primary Parameters of Shielded-Printed Circuit Board to Shielding Effectiveness of Near Magnetic Field;2023 International Symposium on Electromagnetic Compatibility – EMC Europe;2023-09-04

4. Analysis of Electric Field Shielding Effectiveness of Composite Materials Based on Near Field Scanning;2023 6th International Conference on Electronics Technology (ICET);2023-05-12

5. Effective low‐frequency EMI conformal shielding for system‐in‐package (SiP) modules;Microwave and Optical Technology Letters;2023-02-27

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