Study on Heat Transfer Performance of Non-integral Capillary Core Sintered Uniform Plate

Abstract

This paper mainly introduces the sintering process of the monolithic capillary wick and analyzes the influence of different copper powder particle size, filling rate, copper powder shape and heat source size on the heat transfer performance of the isothermal plate. The experimental results show that: (1) For the isothermal plate sintered with spherical copper powder, the capillary force of large particle size copper powder is small, but the flow resistance is also small, and the performance of the isothermal plate sintered with large particle size copper powder is better. (2) In the case of low filling rate, the isothermal plate is dried due to insufficient return fluid. In the case of high filling rate, on the one hand, the thickness of the liquid film at the evaporation end of the isothermal plate is large, resulting in additional thermal resistance. On the other hand, the thin film evaporation mode will be transformed into pool boiling mode, which will reduce the heat transfer performance. (3) Spherical copper powder sintered plate with regular shape has the best performance, while dendritic copper powder sintered plate has relatively high thermal resistance. (4) The heat source area has a great influence on the thermal resistance of the plate. Under the same heating power, the thermal resistance of the small area heat source is much higher than that of the large area heat source; The thermal resistance of sintered copper plate is lower than that of pure copper plate under two heat source areas.