Experimental studies on a novel thin flat heat pipe heat spreader
Author:
Funder
National Natural Science Foundation of China
Publisher
Elsevier BV
Subject
Industrial and Manufacturing Engineering,Energy Engineering and Power Technology
Reference34 articles.
1. High power electronic component: review;Chen;Recent Pat. Eng,2008
2. Micro flat heat pipes for microelectronics cooling: review;Lv;Recent Pat. Mech. Eng,2013
3. An Introduction to Heat Pipes;Peterson,1994
4. Experiments and analyses of flat miniature heat pipes;Cao;J. Thermophys. Heat Transfer,1997
5. Flat miniature heat pipes with micro capillary grooves;Hopkins;J. Heat Transfer,1999
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