Funder
National Natural Science Foundation of China
Subject
Fluid Flow and Transfer Processes,Mechanical Engineering,Condensed Matter Physics
Reference16 articles.
1. High power electronic component: review;Chen;Recent Pat. Eng.,2008
2. Micro flat heat pipes for microelectronics cooling: review;Lv;Recent Pat. Mech. Eng.,2013
3. An Introduction to Heat Pipes;Peterson,1994
4. Heat Pipes;Reay,2013
5. A review of small heat pipes for electronics;Chen;Appl. Therm. Eng.,2016
Cited by
14 articles.
订阅此论文施引文献
订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献