Affiliation:
1. School of Electro-Mechanical Engineering, Xidian University, No. 2, TaiBai South Road, Xi’an, Shaanxi 710071,China
Abstract
Background:
As a new type of advanced packaging and system integration technology, System-
in-Package (SiP) can realize the miniaturization and multi-functionalization of electronic products
and is listed as an important direction of development by International Technology Roadmap for Semiconductors
(ITRS).
Objective:
This paper mainly introduces and discusses recent academic research and patents on package
structure and packaging materials. Additionally, the trend of development is described.
Methods:
Firstly, we analyze and summarize the challenges and existing problems in SiP. Then the
corresponding solutions are introduced with respect to packaging structure and packaging materials.
Finally, the research status of SIP and some patents in these aspects are reviewed.
Results:
In order to increase the density of internal components, SiP products need to use a stacked
structure. The causes of different performance in SiP products are: 1) the stress concentration and bonding
quality problems caused by the chip stack structure; 2) the warpage and package thickness problems
caused by the package stack; 3) thermal conductivity of materials and thermal mismatch between materials;
and 4) dielectric properties and thermomechanical reliability of materials. The following solutions
are summarized: 1) structural optimization of chip stacking and packaging stacking; 2) application of
new packaging technology; 3) optimization of packaging materials; 4) and improvement of packaging
material processing technology.
Conclusion:
With the study of packaging structure and packaging materials, SiP can meet the requirements
of the semiconductor industry and have great future prospects.
Funder
Wuhu-XD Industry, Education and Research Special Fund
National Science Foundation of Shanxi Province
National Natural Science Foundation of China
Publisher
Bentham Science Publishers Ltd.
Subject
General Materials Science
Reference109 articles.
1. Edenfeld D.; Kahng A.B.; Rodgers M.; Zorian Y.; 2003 Technology roadmap for semiconductors. Computer 2004,37(1),47-56
2. Cognetti C.; The third revolution in semiconductor packaging and system integration. 2008 15th IEEE International Conference on
Electronics, Circuits and Systems. St. Julien's, Malta, September,
2008.
3. Hu Y.; Cai J.; Liqiang C.; Lingzhi C.; Ziyu L.; Lulu S.; The research status and development trends of System in Package (SiP) technology. Equip Electron Prod Manuf 2012,41(11),1-6
4. Agonafer D.; Kaisare A.; Hossain M.M.; Lee Y.J.; Dewan-Sandur B.P.; Dishongh T.; Thermo-mechanical challenges in stacked packaging. Heat Transf Eng 2008,29(2),134-148
5. Wenchao T.; Jianglei H.; High-power and high-reliability RF MEMS switch review. Recent Pat Mech Eng 2016,7(2),1-8
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