Thermo-Mechanical Challenges in Stacked Packaging-Reference-Cited by-同舟云学术

Thermo-Mechanical Challenges in Stacked Packaging

Author:

Agonafer Dereje¹,Kaisare Abhijit²,Hossain Mohammad M.³,Lee Yongje⁴,Dewan-Sandur Bhavani P.²,Dishongh Terry³,Pekin Senol³

Affiliation:

1. a Electronics, MEMS, and Nanoelectronics Systems Packaging Center , University of Texas at Arlington , Arlington , Texas , USA

2. b Mechanical and Aerospace Engineering Department , University of Texas at Arlington , Arlington , Texas , USA

3. c Intel Corporation , Chandler , Arizona , USA

4. d Samsung Electronics , Seoul , Korea

Publisher

Informa UK Limited

Subject

Fluid Flow and Transfer Processes,Mechanical Engineering,Condensed Matter Physics

Link

Reference12 articles.

1. Defense Advanced Research Projects Agency, Microsystems Technology Office.

2. http://www.coolingzone.comCooling Zone

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