Key technologies and interfacial fundamentals of wafer plating equipment

Author:

Feng Lei,Dong Jing-Wei,Lai Feng,Zheng Jia-Xing,Gao Run-Yu,You Le-Xing,Fang Jian-Hui,Sun Jian-Jun

Publisher

Science China Press., Co. Ltd.

Subject

Materials Chemistry,General Chemical Engineering,Biochemistry,General Chemistry

Reference104 articles.

1. Edelstein D, Heidenreich J, Goldblatt R, Cote W, Uzoh C, Lustig N, Roper P, McDevitt T, Motsiff W, Simon A. Full Copper Wiring in a Sub-0.25 μm CMOS ULSI Technology. International Electron Devices Meeting. IEDM Technical Digest, 1997: 773–776.

2. Damascene copper electroplating for chip interconnections

3. Chen ST, Lanzillo NA, Van Nguyen S, Nogami T, Simon AH: Interconnect Processing: Integration, Dielectrics, Metals, Springer Handbook of Semiconductor Devices: Springer, 2022: 169–218.

4. Lau JH. Semiconductor Advanced Packaging. Springer Nature, 2021.

5. Yu DQ. 3D Packaging Technology with Through Silicon Vias. Beijing: Publishing House of Electronics Industry, 2021.

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