CACTI 7

Author:

Balasubramonian Rajeev1,Kahng Andrew B.2,Muralimanohar Naveen3,Shafiee Ali1,Srinivas Vaishnav2

Affiliation:

1. University of Utah

2. University of California, San Diego

3. Hewlett Packard Labs

Abstract

Historically, server designers have opted for simple memory systems by picking one of a few commoditized DDR memory products. We are already witnessing a major upheaval in the off-chip memory hierarchy, with the introduction of many new memory products—buffer-on-board, LRDIMM, HMC, HBM, and NVMs, to name a few. Given the plethora of choices, it is expected that different vendors will adopt different strategies for their high-capacity memory systems, often deviating from DDR standards and/or integrating new functionality within memory systems. These strategies will likely differ in their choice of interconnect and topology, with a significant fraction of memory energy being dissipated in I/O and data movement. To make the case for memory interconnect specialization, this paper makes three contributions. First, we design a tool that carefully models I/O power in the memory system, explores the design space, and gives the user the ability to define new types of memory interconnects/topologies. The tool is validated against SPICE models, and is integrated into version 7 of the popular CACTI package. Our analysis with the tool shows that several design parameters have a significant impact on I/O power. We then use the tool to help craft novel specialized memory system channels. We introduce a new relay-on-board chip that partitions a DDR channel into multiple cascaded channels. We show that this simple change to the channel topology can improve performance by 22% for DDR DRAM and lower cost by up to 65% for DDR DRAM. This new architecture does not require any changes to DIMMs, and it efficiently supports hybrid DRAM/NVM systems. Finally, as an example of a more disruptive architecture, we design a custom DIMM and parallel bus that moves away from the DDR3/DDR4 standards. To reduce energy and improve performance, the baseline data channel is split into three narrow parallel channels and the on-DIMM interconnects are operated at a lower frequency. In addition, this allows us to design a two-tier error protection strategy that reduces data transfers on the interconnect. This architecture yields a performance improvement of 18% and a memory power reduction of 23%. The cascaded channel and narrow channel architectures serve as case studies for the new tool and show the potential for benefit from re-organizing basic memory interconnects.

Funder

NSF

Center for Design-Enabled Nanofabrication

Publisher

Association for Computing Machinery (ACM)

Subject

Hardware and Architecture,Information Systems,Software

Reference58 articles.

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2. G. W. Burr M. J. Breitwisch M. Franceschini D. Garetto K. Gopalakrishnan B. Jackson B. Kurdi etal 2010. Phase Change Memory Technology. Retrieved May 6 2017 from http://arxiv.org/abs/1001.1164v1. G. W. Burr M. J. Breitwisch M. Franceschini D. Garetto K. Gopalakrishnan B. Jackson B. Kurdi et al. 2010. Phase Change Memory Technology. Retrieved May 6 2017 from http://arxiv.org/abs/1001.1164v1.

3. K. Chandrasekar C. Weis Y. Li S. Goossens M. Jung O. Naji B. Akesson N. Wehn and K. Goossens. 2012. DRAMPower: Open Source DRAM Power and Energy Estimation Tool. Technical Report. DRAMPower. K. Chandrasekar C. Weis Y. Li S. Goossens M. Jung O. Naji B. Akesson N. Wehn and K. Goossens. 2012. DRAMPower: Open Source DRAM Power and Energy Estimation Tool. Technical Report. DRAMPower.

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