Exploring compromises among timing, power and temperature in three-dimensional integrated circuits-Reference-Cited by-同舟云学术

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Exploring compromises among timing, power and temperature in three-dimensional integrated circuits

Published:2006 Issue: Volume: Page:
ISSN:
Container-title:Proceedings of the 43rd annual conference on Design automation - DAC '06
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Author:

Hua Hao,Mineo Chris,Schoenfliess Kory,Sule Ambarish,Melamed Samson,Jenkal Ravi,Davis W. Rhett

Publisher

ACM Press

Cited by 10 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

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4. OpenPiton;Proceedings of the Twenty-First International Conference on Architectural Support for Programming Languages and Operating Systems;2016-03-25

5. NoC Modeling and Topology Exploration;Designing 2D and 3D Network-on-Chip Architectures;2013-10-09

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