Understanding the Impact of Air and Microfluidics Cooling on Performance of 3D Stacked Memory Systems
Author:
Affiliation:
1. School of Electrical and Computer Engineering, Georgia Institute of Technology, Atlanta, Georgia
Publisher
ACM
Link
https://dl.acm.org/doi/pdf/10.1145/2989081.2989098
Reference23 articles.
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3. Comparison of micro-pin-fin and microchannel heat sinks considering thermal-hydraulic performance and manufacturability. Components and Packaging Technologies;Jasperson B. A.;IEEE Transactions on,2010
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