ART-3D: Analytical 3D Placement with Reinforced Parameter Tuning for Monolithic 3D ICs-Reference-Cited by-同舟云学术

ART-3D: Analytical 3D Placement with Reinforced Parameter Tuning for Monolithic 3D ICs

Published:2022-04-13 Issue: Volume: Page:
ISSN:
Container-title:Proceedings of the 2022 International Symposium on Physical Design
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Author:

Murali Gauthaman¹,Shaji Sandra Maria¹,Agnesina Anthony¹,Luo Guojie²,Lim Sung Kyu¹

Affiliation:

1. Georgia Institute of Technology, Atlanta, GA, USA

2. Peking University, Beijing, China

Funder

DARPA ERI 3DSOC

Semiconductor Research Corporation

National Research Foundation of Korea

Publisher

ACM

Link

https://dl.acm.org/doi/pdf/10.1145/3505170.3506725

Reference12 articles.

1. Pseudo-3D Approaches for Commercial-Grade RTL-to-GDS Tool Flow Targeting Monolithic 3D ICs

2. S. Surya , K. Pentapati , K. Chang , V. Gerousis , R. Sengupta , and S. Lim , “ Pin-3D: A Physical Synthesis and Post-Layout Optimization Flow for Heterogeneous Monolithic 3D ICs ,” in 2020 IEEE/ACM International Conference On Computer Aided Design , 2020 . S. Surya, K. Pentapati, K. Chang, V. Gerousis, R. Sengupta, and S. Lim, “Pin-3D: A Physical Synthesis and Post-Layout Optimization Flow for Heterogeneous Monolithic 3D ICs,” in 2020 IEEE/ACM International Conference On Computer Aided Design, 2020.

3. Snap-3D: A Constrained Placement-Driven Physical Design Methodology for Face-to-Face-Bonded 3D ICs

4. Study of Through-Silicon-Via Impact on the 3-D Stacked IC Layout

5. ePlace-3D

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